JIANGSU, ZHENJIANG, CHINA, January 23, 2026 /EINPresswire.com/ -- As the global industrial sector demands higher levels ...
Abstract: Considering the non-uniform bonding pressure due to the downward push of the indenter, this study proposes a mechanical model to analyze the interfacial contact behavior during direct wafer ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results