The manufacturing industry is constantly on the lookout for more efficient manufacturing materials, but most new methods for developing such materials created in the lab are not suited for ...
New advanced interconnect PDKs pave the way for high density, energy efficient chip to chip integration.
A novel negative-tone, photosensitive, polymeric bonding material is proposed that can be used as a dielectric enabling polymer/metal hybrid bonding. August 18th, 2022 - By: Brewer Science Wafer-level ...
An evaluation of a negative-tone i-line photosensitive polymeric bonding material for achieving prebonding in Cu/polymer hybrid bonding at low temperatures via the Cu damascene process. The polymeric ...
A soft polymer that hardens on impact uses force-activated molecules to rewire its own structure, achieving record stiffness and 97% force reduction.
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